Design of the bonded joint.

This is the first phase of the entire bonding process, and governs that condition for the success of the subsequent phases and especially the final outcome.

In order to achieve an outcome “excel”, you should analyze and define some fundamental aspects that can not in any way be excluded or replaced:

Requirements analysis;

Carried out in a critical manner, allows to identify and outline all those variables that can affect on the final result, derivable from the analysis of some fundamental aspects, such as the junction area, the size and shape of the surfaces, the environmental factors in which the coupling is involved, the stress (compressive, tensile, peeling), the size of the surfaces, the surface finishes.

The ordering of the coupling;

Allows you to determine the allocation of the Class of   joint, usually identified three classes that move in opposite inversely proportional to the damage that can result in failure;

The environmental conditions;

Knowing the environmental conditions on the use of the joint, allows fixing on the design, facilitating the choice of the adhesive and its qualification.

For an assessment of some environmental effects we can see the UNI EN ISO 9142.

The analysis of the materials to be joined;

Used to verify consistency in the requirements, compatibility with other phases of the process including adhesives, through the analysis of physical and mechanical characteristics.

Knowledge of adhesives;

Knowing the physic,  characteristics behavior, applicability, strength, responsiveness to specific rules, respect for health and safety, allows you to properly design and develop a joint production process (application – drying) suitable to achieve requirements.

Classification of the joint

Activities defines the geometry of the junction and its requirements into account all the results of the analysis, whose graphical representation is given in EN ISO 15785.

Designated the joint, defined its requirements, we can move on to the next stage of “Coordination of the bonding process.”